PKG TEST
-
01IQC
A process in which Quality Control team inspects Wafer through designated devices or equipment before final TEST procedure based on the criteria agreed with customers
-
02TDBI
TDBI is a process to reveal potential defects to visible faults by capitalizing on severe stress conditions (temperature/voltage), which aims to provide customers trustworthy products by accelerating early failure period before shipment
-
03TEST
A process to verify reliability of semiconductor by electrifying package to test its function at various level of temperature
-
04MARKING
A process to use Laser marking equipment to mark the name of manufacturer, date of manufacturing, product information on the surface of semiconductor packages
-
05FVI/LIS
A process to distinguish any normality or fault on the surface of finalized semiconductor package with naked eyes, microscope or devices or equipment for visual inspection
-
06BAKE
A process to remove water from the substrate surface of tested wafer by baking at high temperatures for a specific period of time
-
07TAPE&REEL
A process to pack the product with tape and reel according to customers' requests
-
08QPV
A process to test whether probe test has been undertaken properly through sampling test according to the customers' demands
-
09PACKING
A packing process of the approved products before shipping to accommodate the customers' requests
-
10SHIPPING
A delivering process of the packed products to customers
